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本期内容
2017年2/3月刊
专题 Cover Story
用锡铅焊料SMT回流来降低纯锡应用的风险——业界的论证结果
Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow– Results of an Industry Round—Robin
专栏 Column
连接器与引脚的最佳贴装: 
测量旋转周长和填埋深度
Perfect Placement of Connectors and Pins: 3D Measurement of Swash Circumference and Embedment Depth
Jens Mille, Jens Kokott(GÖPEL ELECTRONIC公司)
真空焊接技术的优势
What are the Benefits of Soldering with Vacuum Profiles?
Helmut Öttl和Paul Wild, 锐德热力设备有限公司
编者手记 Editors Note
2017年七大全球技术趋势
The Top Seven Global Technology Trends for 2017
赵雪芹
市场动态 Market Watch
关于销售与市场推广的调查
Much Ado about Sales and Marketing
I-Connect007 Research Team
NEPCON China 2017 卓越品质,汇聚商机
NEPCON China 2017 with Excellent Quality, Gathering Business Opportunities
SMT设备正在进行哪些创新升级?
What Innovation and Upgrade for SMT Equipment is in Progress?
我的看法 My Viewpoints
IPC: 
帮助会员企业进行创新和提高竞争力
IPC: Helps Enterprises to Innovate and Improve Competitiveness
轴心: 
点胶市场热,企业信心来自高性价比的产品
axxon: Business Confidence Being from its High Cost-Effective Products
技术特写 Tech Features
应用于大功率器件封装的新型焊接材料纳米银膜
Flexible Nano-Silver Film with High Thermal Conductivity for IGBT Bonding
何天贤 李志豪, 广州汉源新材料股份有限公司
选择正确的粘合剂: 
提高扬声器生产效率
selecting the Correct Adhesive: Rising the Productivity of Speaker
Matthias Stollberg, 德路公司
低间隙清洗中的流体力学研究
Fluid Flow Mechanics Keys to Low Standoff Cleaning
Jimmy Tian,( ZESTRON China, Shenzhen, China) Joachim Becht, Ph.D.,( ZESTRON Europe, Ingolstadt, Germany)
SMT一步步 SMT Step by Step
如何选择选择焊系统(三)
selecting a selective Soldering System, Part 3
Robert Voigt, DDM Novastar公司
产品 Products
产品特写
Featured Products
期刊选择
 
 
 
 
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