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本期内容
2018年2/3月刊
专题 Cover Story
探索PCBA的返工与维修
A Look Into PCBA Rework And Repair
Stephen Las Marias,I-Connet007
编者手记 Editors Note
PCBA返修的挑战
PCBA rework and repair challenge
赵雪芹
市场动态 Market Watch
慕尼黑上海电子生产设备展诠释未来智造创新元素
electronica China showing innovation elements of future smart factory
2018年NEPCON China上海展助力智慧智造
NEPCON China 2018 to help intelligent manufacturing
传统工厂到智慧工厂还有多远?
How long from traditional factory to smart factory?
迎合时代潮流,摩尔共享标签平台强势来袭!
To meet the trend of The Times, Moresoft launched Shared the tag platform
我的看法 My Viewpoints
新应用的增长驱动半导体和SMT 行业增长
New applications driving growths of both semiconductor industry and surface mount technology
Mr. Roger Lee 李家伦(富士德中国有限公司CEO 首席执行官 )
“互联网+生产”打造新型工业生产方式
“internet+ production” makes a new industrial mode of production
专栏 Column
返工与可靠性: 
越简单越好!
Rework and Reliability: Less is More!
Karen Tellefsen,Alpha Assembly Solutions
新一代钢网涂层技术: 
SMT Nanoslic纳米涂层
New generation stencil coating technology: SMT Nanoslic coating
柔性电路的返工与维修
Rework and Repair on Flex Circuits
Bob Wettermann, BEST INC.
技术特写 Tech Features
高可靠性的汽车电子缘何而来?
Cleaner Concentration Monitoring for High-Reliability Electronics
实现完美的焊点: 
关于焊接技术的许多展望
Achieving the Perfect Solder joint: The Many Perspectives on Soldering
Stephen Las Marias, I-CONNECT007
触摸薄膜贴合工艺应用
Touch film bonding process and its applications
范周峰, 程华辉, 刘伟达;德赛西威公司
产品 Products
产品特写
Featured Products
期刊选择
 
 
 
 
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