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热门: AOI 焊锡桥连 焊锡桥
本期内容
2017年4/5月刊
专栏 Column
浅析3D X-ray焊锡空洞测量的关键参数
Analyze Key Parameters of 3D X-ray Measuring Solder Hole
朱夏川, 海能达通信股份有限公司项目经理兼SMT工艺高级工程师
工业4.0时代的智能返修
Smart Rework in the Industrial 4.0 Era
谢健浩, 德国埃莎亚太区办事处
编者手记 Editors Note
产业升级, 市场向好, 挑战和机遇并
Upgrade of Traditional Manufacturing, Market being Rising, Challenges and Opportunities Coexist
赵雪芹
市场动态 Market Watch
如何选择EMS合伙人
Choosing an EMS Partner
W. Scott Fillebrown(LIBRA INDUSTRIES公司)
寻找最佳的二手SMT设备供应商
The Hunt for the Best Pre-Owned SMT Equipment Supplier
Shannon Allard(NORTHERN ELECTRONICS AUTOMATION (NEA) OF NH LLC)
新型激光焊接工艺有效提升焊缝质量、稳定性并降低制造成本
New Laser Welding Process Effectively Improve Weld Quality& Stability and Reduce the Manufacturing Cost
2017慕尼黑上海电子生产设备展,催生产业发展新动
Creating New Energy for Industry Development with productronica China 2017
我的看法 My Viewpoints
来自ERSA(德国埃莎)的心声: 
我们始终视服务为生命
The Voice from ERSA: We are always Taking Service for Life
高精确度计量成就自动化和智能化
High Precise Dosing Technology Meets Challenges for Automation and Intellectualization
采访ViscoTec 德国维世科大中华地区总经理Markus Schultz 马科斯
VirTex论述EMS的挑战、新技术及其发展趋
VirTex Discusses EMS Challenges, New Technologies and Trends
封面专题 Cover Story
选择正确的助焊剂: 
不同类型助焊剂的优缺点
Choosing the Correct Flux –Advantages/Disadvantages
Eddie Groves, 美国选择焊学会       Jonathan Wol, PILLARHOUSE(美国)公司
技术特写 Tech Features
ENEPIG微小焊点的性能评
Evaluation of the Use of ENEPIG in Small Solder joints
Ben Gumpert, William Fox, C. Don Dupriest, LOCKHEED MARTIN公司
在分板过程中切割电路板基板时激光能量对材料的影响
Material Effects of Laser Energy When Processing Circuit Board Substrates During Depaneling
Ahne Oosterhof, EASTWOOD CONSULTING
焊盘限定或掩膜限定——哪种设计方法更优?
Pad Defined vs. Mask Defined: Which Method is Optimal?
Mitch Holtzer, ALPHA ASSEMBLY SOLUTIONS
SMT一步步 SMT Step by Step
如何选择选择焊系统(四)
selecting a selective Soldering System, Part 4
Robert Voigt, DDM Novastar公司
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